Blind & Buried Via Technology
HDI PCB (High Density Interconnect Printed Circuit Board)is created through Microvia and/or buried vias and sequential lamination with insulation materials and conductor wiring for higher density components. Once PCB spacing is limited, or you are operating with tight PTHs (plated through holes) constraints, Blind and Buried Vias is also the solution. Blind & Buried Via technology has vie a polar role in compressing a lot of capability into a smaller house space. By shortening vias to solely suffer necessary layers, a lot of extent area become obtainable for electronic components.
Key advantages include:
Blind Via may be not a copper plated hole that connects just one outer layer to at least one or a lot of inner copper layers. A blind via never goes all the manner through a printed circuit board. In terms of circuit board design, blind vias are defined in a unique separate drilling file.
Additional advantage of Blind Vias: Ability to widen BGA(ball grid array) breakout channel (layer count reduction)
Buried Via is a copper plated-thru hole that connects 2 or more inner layers, with no contact with the outer layer. It's not possible to detect a buried via as it is "buried" because the outer layer surfaces of a PCB. Buried vias conjointly need a unique separate drill file as Buried Vias.
Additional Advantages of Buried Vias
Season Multilayer has years of experience in manufacturing PCBs with Blind & Buried Vias. Both our engineers and production facility are equipped to handle the intricacy this technique requires, with very high accuracy. While this technique is more costly, we have seen savings through the reduction of layers or board size. This trend is becoming more and more popular within the PCB industry.
